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Microchip unveils first 3nm PCIe Gen 6 switch to power modern AI infrastructure
Intel unveils Panther Lake architecture: First AI PC platform built on 18A
Global 300mm fab equipment spending expected to total $374 bn over next three years
EuroHPC JU selects six additional AI factories to expand Europe’s AI capabilities
SEMICON Europa 2025 to highlight innovations to bolster Europe’s semiconductor resilience
Qualcomm to acquire Arduino—Accelerating developers’ access to leading edge computing and AI
Siemens and Ducati extend partnership to advance innovation in MotoGP
RECIF Technologies adopts Agileo Automation’s combined Speech Scenario and E84 PIO Box Solution
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