TSMC—The center of the semiconductor universe!

TSMC’s dominance in the global foundry market has never been more visible. While rivals scramble to secure orders, TSMC is accelerating the rollout of its 2nm technology, expanding its global footprint, and quietly resetting the economics of chipmaking itself. 

TSMC is now moving toward mass production at four 2 nm fabs—two in Hsinchu’s Baoshan district, and two others in the Kaohsiung’s Nanzi Park—each using Gate-All-Around (GAA) nanosheet transistors that lower switching power 25 percent and boost transistor density 15 percent versus the 3 nm node. Together, these facilities will exceed 60,000 wafers per month by 2026, with the first trial lots already under way.

In Kaohsiung, Fab 22’s P1 line has reached 10,000 wafers per month, while P2 is being tooled for qualification before year-end. North in Hsinchu, Fab 20’s P1 has completed risk-ramp testing and is shifting to full production as P2 readies for the A14 generation. 

Subsequent P3 and P4 modules are rising in parallel to serve A16 and A14 nodes. Collectively, these fabs will deliver 2 nm output of roughly 200,000 wafers per month by 2028—more than all other competitors combined at this geometry.

Financially, TSMC’s Q2 2025 revenue reached US $30.24 billion, up 18.5% quarter-over-quarter, while Q3 2025 surged 30% year-over-year to US $32.5 billion, driven by relentless AI demand from Nvidia, AMD, and Broadcom. 

-- Kristian Castellano, Director of Marketing at The Information Network, USA.