esdm
STMicroelectronics joins FiRa board, strengthening commitment to UWB ecosystem and automotive Digital Key adoption
CSP capex to soar past $520 billion in 2026, driven by GPU procurement and ASIC development
Amkor breaks ground on semiconductor advanced packaging and test campus in Arizona; Expands investment to $7bn
Supercomputing India 2025 sets the stage for HPC, AI, and quantum innovation
Semiconductor boom in India: IIT Jammu's role in shaping future talent
Gen AI reshapes global processor market, driving unprecedented growth
Renesas expands industrial sensing portfolio with 3 magnet-free inductive position sensor ICs and design tool
HCLTech joins MIT Media Lab in US to collaborate on next-gen AI research
/dq/media/agency_attachments/UPxQAOdkwhCk8EYzqyvs.png)
/dq/media/media_files/2025/10/16/skywire-2025-10-16-11-49-01.jpg)
/dq/media/media_files/2025/10/16/fira-2025-10-16-11-43-12.png)
/dq/media/media_files/2025/10/15/csp-tf-2025-10-15-12-55-57.jpg)
/dq/media/media_files/2025/10/15/amkor-2025-10-15-12-48-43.jpg)
/dq/media/media_files/2025/10/15/hpcaiqc-2025-10-15-12-43-43.jpg)
/dq/media/media_files/2025/10/15/power-studio-2025-10-15-12-33-23.jpg)
/dq/media/media_files/2025/10/15/1-2025-10-15-12-26-49.jpeg)
/dq/media/media_files/2025/10/14/processor-2025-10-14-12-46-05.jpg)
/dq/media/media_files/2025/10/14/renesas-3446-ips-2025-10-14-12-35-54.jpg)
/dq/media/media_files/2025/10/14/hcltech-2025-10-14-12-31-33.jpg)
