intel
Ansys thermal and multiphysics solutions certified for Intel 18A process and 3D-IC designs
Siemens and Intel Foundry collaborate for ICs and advanced packaging solutions for 2D- and 3D-IC
Synopsys and Intel Foundry propel Angstrom-scale chip designs on Intel 18A and Intel 18A-P
Intel expands foundry ecosystem with TSMC, UMC, and Taiwanese IP partners
China’s new chip-origin rules put foundries and IDMs on edge: 35 US fabs update
Tariffs on chip gear could spike US fab costs: TSMC reportedly to spend $6bn or more
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