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Ansys thermal and multiphysics solutions certified for Intel 18A process and 3D-IC designs
Siemens and Intel Foundry collaborate for ICs and advanced packaging solutions for 2D- and 3D-IC
Synopsys and Intel Foundry propel Angstrom-scale chip designs on Intel 18A and Intel 18A-P
Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
Ansys allies with TSMC on advanced node processes certification and 3D-IC multiphysics design solutions
Synopsys and TSMC usher In Angstrom-scale designs with certified EDA flows on advanced TSMC A16 and N2P processes
Cadence enables next-gen AI and HPC systems with industry’s fastest HBM4 12.8Gbps IP memory system solution
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