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Siemens to bring advanced timing constraint capabilities to EDA design flow with Excellicon acquisition
Siemens leverages AI to close industry’s IC verification productivity gap in Questa One
Cadence unveils Millennium M2000 supercomputer with Nvidia Blackwell systems
CELUS design platform integrates with Cadence OrCAD X platform to revolutionize hardware design
Ansys thermal and multiphysics solutions certified for Intel 18A process and 3D-IC designs
Siemens and Intel Foundry collaborate for ICs and advanced packaging solutions for 2D- and 3D-IC
Synopsys and Intel Foundry propel Angstrom-scale chip designs on Intel 18A and Intel 18A-P