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Ansys thermal and multiphysics solutions certified for Intel 18A process and 3D-IC designs

Ansys is progressing certification for Intel 18A-P and collaborating on enablement for Intel 14A-E; joins the Intel Foundry Chiplet Alliance.

By DQI Bureau
May 05, 2025 12:11 IST 2 Min read
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Siemens and Intel Foundry collaborate for ICs and advanced packaging solutions for 2D- and 3D-IC
By DQI Bureau
Apr 30, 2025 19:32 IST 4 Min read
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Synopsys and Intel Foundry propel Angstrom-scale chip designs on Intel 18A and Intel 18A-P
By DQI Bureau
Apr 30, 2025 12:25 IST 3 Min read
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Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
By DQI Bureau
Apr 25, 2025 13:10 IST 3 Min read
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Ansys allies with TSMC on advanced node processes certification and 3D-IC multiphysics design solutions
By DQI Bureau
Apr 24, 2025 12:37 IST 3 Min read
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Synopsys and TSMC usher In Angstrom-scale designs with certified EDA flows on advanced TSMC A16 and N2P processes
By DQI Bureau
Apr 24, 2025 12:30 IST 4 Min read
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Cadence enables next-gen AI and HPC systems with industry’s fastest HBM4 12.8Gbps IP memory system solution
By DQI Bureau
Apr 22, 2025 12:52 IST 2 Min read
Cadenceesdm
Cadence to acquire Arm Artisan Foundation IP business
By DQI Bureau
Apr 21, 2025 14:20 IST 2 Min read
esda1esdm
Electronic System Design industry inks $4.9 billion revenue in Q4-2024
By DQI Bureau
Apr 19, 2025 11:48 IST 2 Min read
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Synopsys accelerates chip design with Nvidia Grace Blackwell and AI to speed EDA
By DQI Bureau
Mar 19, 2025 12:51 IST 3 Min read
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