SEMI and TechSearch International release semiconductor assembly & test facility database
Quantum strategy: Don’t regulate what hasn’t matured – fund it, build it, and scale it!
AI, HPC fuel advances in packaging 3DIC, FOPLP, and chiplet forums
SIA applauds passage of strengthened semiconductor investment credit
US, Japan lead government-backed EUV push, as South Korea reportedly lags
China’s open-source AI push expands after DeepSeek, as Baidu and Huawei launch new models
Glass core, high-end ICs substrates for AI, to push advanced IC substrate market to $31bn by 2030
Europe's largest PVT plant goes into operation @ Vienna Sports Arena
/dq/media/agency_attachments/UPxQAOdkwhCk8EYzqyvs.png)
/dq/media/media_files/2025/07/08/navitas-2025-07-08-12-55-27.jpg)
/dq/media/media_files/wWchuNH3yCpLf5AwSlIs.png)
/dq/media/media_files/2025/02/19/oyI9XwVDGxugPrcp5tvG.png)
/dq/media/media_files/2025/07/07/reach-2025-07-07-12-25-44.jpg)
/dq/media/media_files/2025/07/07/packaging-2025-07-07-12-17-06.jpg)
/dq/media/media_files/2025/07/04/asml-2025-07-04-14-39-36.jpg)
/dq/media/media_files/2025/07/04/baidu-ernie-model-2025-07-04-14-32-37.jpg)
/dq/media/media_files/2025/07/04/ic-substrate-2025-07-04-12-57-48.jpg)
/dq/media/media_files/2025/07/04/vienna-arena-2025-07-04-12-54-26.jpg)
