TSMC reportedly fast-tracks US packaging plants for 2H26 construction, 2028 production
ADI adopts NVIDIA Jetson Thor to advance physical intelligence and reasoning for humanoids
Kodiak taps NXP's ISO 26262-compliant processors and interfaces to operate autonomous trucks
TSMC reportedly eliminates Chinese equipment use in 2nm production as US rules loom
Infineon and SIHUB to foster innovation in Vietnam’s startup ecosystem
Innovations in digital cockpit tech boosting automotive AI chipset
Advanced chip packaging market size likely to grow to $79.85bn by 2032
51% of employees believe offices could become obsolete: GoTo Research