NVIDIA Rubin platform, Open models, autonomous driving presents blueprint for future at CES
U.S. Council: NVIDIA-Huawei AI chip gap could reach 17× by 2H27, yet H200 exports risk aiding China
Chips JU advances quantum and semiconductor innovation with an investment over €659mn
Plug, Play, Scale: The fintech advantage in India’s BaaP revolution
TSMC’s bold pivot: Kumamoto Fab 2 reportedly leaps from 6nm to 2nm amid JASM losses
Wide bandgap semiconductor market to generate USD 4.66 billion by 2032
The future is cross-skilled why Cloud + AI + Security is the winning combo
AMD, NVIDIA and others reportedly to debut new chips at CES 2026, spotlighting TSMC 3nm and 5nm
/dq/media/agency_attachments/UPxQAOdkwhCk8EYzqyvs.png)
/dq/media/media_files/2026/01/06/nvidia-rubin-platform-2026-01-06-13-20-37.jpg)
/dq/media/media_files/2026/01/06/intel-18a-2026-01-06-13-24-51.jpg)
/dq/media/media_files/2026/01/06/huang1-2026-01-06-13-14-11.jpg)
/dq/media/media_files/2025/12/31/nvidia-2025-12-31-15-43-58.jpg)
/dq/media/media_files/2026/01/03/chipsju-2026-01-03-13-24-59.png)
/dq/media/media_files/2024/12/26/Q9D87fHN2wHmDQVe5Pkd.png)
/dq/media/media_files/2026/01/03/tsmc-jasm-cc-wei-2026-01-03-13-29-57.png)
/dq/media/media_files/2026/01/03/wbg1-2026-01-03-13-14-01.jpg)
/dq/media/media_files/2025/10/17/cloud-sovereignty-2025-10-17-10-54-28.jpg)
/dq/media/media_files/2026/01/05/ces-2026-01-05-12-57-30.jpg)
