AMD, NVIDIA and others reportedly to debut new chips at CES 2026, spotlighting TSMC 3nm and 5nm

CES 2026 is set to open on January 6, with major companies expected to unveil new chips, drawing broad industry attention. According to Commercial Times, upcoming processors from AMD, Qualcomm, and NVIDIA are all slated to be manufactured by TSMC, primarily using its 3nm and 5nm process technologies—underscoring continued momentum for TSMC’s advanced nodes.

For CES 2026, this year’s show continues to center on the theme of “AI Everywhere,” with the spotlight returning to on-device AI PC applications. The report notes that amid rising memory costs, the way leading CPU and GPU makers leverage advanced process technologies to boost computing efficiency has become a critical focus.

Major chips at CES 2026 reinforce TSMC’s central role
Regarding key highlights to watch, the report notes that AMD is set to unveil its Ryzen AI 400 and 9000G series CPUs. NVIDIA is expected to detail the mass-production progress of its Blackwell platform and outline the roadmap for its next-generation Rubin platform, with a focus on applications such as agentic AI and humanoid robots. In addition, Qualcomm’s Snapdragon X2 series is slated to make its official debut in commercial devices.

As the report indicates, TSMC is expected to manufacture most of the processors mentioned above, industry sources say. These include AMD’s Ryzen AI 400, which uses a 4nm process and combines chiplet architecture with heterogeneous integration, as well as Qualcomm’s Snapdragon X2 series built on TSMC’s N3P node. In addition, NVIDIA is also a long-standing partner of TSMC.

Meanwhile, as the report highlights, Intel views CES as a pivotal moment to rebuild market confidence in its mobile platform strategy. The official debut of its next-generation Core Ultra (Panther Lake) is widely seen as a critical test of the success of Intel’s 18A process. Within the chip, the GPU and I/O dies are fabricated by TSMC using its N3E and N6 processes, the report adds. Beyond the Panther Lake debut, Intel is also expected to unveil several additional updates, including refreshed Arrow Lake CPUs for both desktop and laptop platforms, according to Wccftech.

As most of the products unveiled by major chipmakers at CES 2026 are expected to be manufactured by TSMC, supply-chain sources say the company is continuing to expand its 3nm capacity, with Phase 9 of Fab 18 at the Southern Taiwan Science Park being accelerated.

Source: TrendForce, Taiwan.