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Siemens Digital

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Siemens and ASE collaborate on workflows for ASE’s VIPack advanced packaging platform

Siemens and ASE have validated 3Dblox workflows for three VIPack technologies -- Fanout Chip-on-Substrate, (FOCoS), Fanout Chip-on-Substrate-Bridge (FOCoS-Bridge), and Through Silicon Via (TSV)-based 2.5D and 3D IC. 

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