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advanced-packaging

AMD Radeon esdm

Advanced packaging: How AI is revolutionizing the game?

High-end performance packages with 2.5D/3D approaches are used today to package AI processors like GPUs, and AI ASICs, as well as HBM. AI server market driving adoption of 2.5D/3D packaging technologies

By DQI Bureau
Feb 04, 2025 14:10 IST 2 Min read
pah esdm
Emerging trends and key markets in 2.5D / 3D advanced packaging technologies
By DQI Bureau
Nov 08, 2024 11:46 IST 5 Min read
Fine pitch Packaging Features
Co-development of advanced CMOS logic and advanced packaging key for next-gen HPC devices
By Pradeep Chakraborty
Nov 27, 2023 08:31 IST 2 Min read
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