esdm
Quantum strategy: Don’t regulate what hasn’t matured – fund it, build it, and scale it!
AI, HPC fuel advances in packaging 3DIC, FOPLP, and chiplet forums
SIA applauds passage of strengthened semiconductor investment credit
US, Japan lead government-backed EUV push, as South Korea reportedly lags
China’s open-source AI push expands after DeepSeek, as Baidu and Huawei launch new models
Glass core, high-end ICs substrates for AI, to push advanced IC substrate market to $31bn by 2030
Europe's largest PVT plant goes into operation @ Vienna Sports Arena