Taiwan, Japan, focus on stronger collaborations with Indian companies
Next funding round of $504 million for 12 tech hubs across America
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Global semiconductor fab capacity to expand 6% in 2024, and 7% in 2025
CEA-Leti launches FAMES pilot line as part of EU Chips Act Initiative
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CEA-Leti's complementary developments in 3D integration technologies
Agreement for second European exascale supercomputer Alice Recoque
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