US DoC appoints Bill Frauenhofer as Director of CHIPS Program Office
TDK launches wide frequency range wire-wound inductors for automotive power-over-coax apps
The power of predictive supplier scoring: A smarter approach to risk management
Tackling impersonation, paper leaks in exams with tech-first solutions
Samsung to produce Tesla’s AI6 chips, escalating 2nm race with TSMC
TSMC to exit GaN production by July 2027; repurposes fab for advanced packaging
Convergence of AI and semiconductor engineering in GCC’s digital transformation roadmap
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