Microchip expands India footprint with new office facility in Bengaluru
Worldwide silicon wafer shipments increase 3% year-on-year in Q3-2025
Siemens updates Designcenter Solid Edge with AI and cloud-driven enhancements
Glass core substrates and interposers: New growth engines for glass in advanced packaging for AI and HPC
SiCarrier subsidiaries reportedly launch China’s fully-independent EDA, 3nm test equipment
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