SEMI showcases Conductor intelligence platform for enhanced global supply chain collaboration
Silex announces Wi-Fi 6E tri-band embedded module based on NXP IW623 chipset
Intel collaborates with LG Innotek to implement an AI-powered smart factory
SAL receives Applied Materials PECVD tool for 200mm dielectrics thin films deposition
AGC participating in "JOINT3" Consortium to develop next-gen semiconductor packaging
Tech giants accelerate investment, AR glasses shipments to reach 32.1 mn units by 2030
Genesys, ServiceNow push Agentic AI into mainstream customer service
Tariffs on semiconductors? Investment shifts and global geopolitical tensions