0
By clicking the button, I accept the Terms of Use of the service and its Privacy Policy, as well as consent to the processing of personal data.
Don’t have an account? Signup
Powered by :
Current near-term challenges being addressed by the OCP Community include developing advanced 3D-IC design kits that streamline chiplet integration with today's EDA tools, establishing standardized form factors to simplify chiplet-based designs, etc.
Share this article
If you liked this article share it with your friends.they will thank you later