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CEA-Leti

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R&D advances for FAMES pilot line: 400 °C CMOS breakthrough opens critical doors to 3D integration goals

Presented at the recently-held IEDM 2025, the next-generation chip stacking will be key enabler for More-Than-Moore devices and applications in future

By DQI Bureau
Dec 16, 2025 11:12 IST 2 Min read
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Joint work shows next generations of RF and optical front-end modules (FEM)
By DQI Bureau
Dec 15, 2025 09:41 IST 2 Min read
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CEA-Leti to launch multilateral program to accelerate AI with MicroLED data links
By DQI Bureau
Dec 04, 2025 13:31 IST 2 Min read
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Soitec and CEA to develop automotive cyber security with advanced FD-SOI technology
By DQI Bureau
Nov 12, 2025 16:00 IST 2 Min read
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French team led by CEA-Leti develops first hybrid memory tech enabling on-chip AI learning and inference
By DQI Bureau
Sep 26, 2025 12:06 IST 3 Min read
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CEA-Leti to present ultra-compact, high-res AR/VR displays @ MicroLED Connect
By DQI Bureau
Sep 22, 2025 13:07 IST 2 Min read
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Niobium superconducting interconnects open new horizons for quantum computing
By DQI Bureau
Jul 18, 2025 12:32 IST 3 Min read
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CEA-Leti and Soitec partner for FD-SoI for enhanced security of ICs
By DQI Bureau
Jun 19, 2025 12:37 IST 2 Min read
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Applied Materials and CEA-Leti expand joint lab to drive innovation in specialty chips
By DQI Bureau
Jun 17, 2025 13:14 IST 2 Min read
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AI integration, photonics, edge computing and sustainable electronics key: 27th LID World Summit
By DQI Bureau
Jun 04, 2025 12:04 IST 2 Min read
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