TI collaborates with NVIDIA to enable 800V power systems for next-gen AI data centres

Texas Instruments (TI) has announced a strategic collaboration with NVIDIA to support the development of next-generation 800V high-voltage direct current (HVDC) power-distribution systems for AI data centres. The joint effort will focus on advanced power management and sensing technologies, aiming to deliver scalable, reliable, and power-efficient infrastructure for future AI workloads.

TI is working closely with NVIDIA to build the underlying semiconductor technologies needed for 800V HVDC architectures that will support the growing power demands of AI data center servers. These new systems will replace the traditional 48V distribution frameworks that are becoming inefficient and unsustainable at higher power levels.

The exponential growth of AI computing is drastically increasing the power requirements of data centers. The average power per rack is expected to leap from 100kW today to over 1MW in the near future. Existing 48V systems are not equipped to handle this jump; delivering 1MW would require nearly 450 pounds of copper wiring, making the setup impractical.

By transitioning to 800V HVDC systems, engineers can achieve higher power density, better conversion efficiency, and significantly reduce the size and weight of power delivery components. This approach will allow data centres to scale efficiently and sustainably as AI continues to advance.

The collaboration was announced by TI from its headquarters in Dallas. The technologies developed through this partnership will support NVIDIA’s future data centre builds, although a specific deployment timeline has not been disclosed.

TI will develop the power conversion and sensing technologies needed for 800V HVDC infrastructure. These systems will enable AI data centres to manage higher workloads while minimising inefficiencies and physical limitations of current power systems.