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Texas Instruments Power Modules Get Miniaturized, Performance Soars

New power modules with MagPack™ technology deliver up to 50% size reduction compared to previous generations, doubling power density while maintaining excellent thermal performance.

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DQINDIA Online
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Power Modules

Texas Instruments (TI) is shaking up the power design game with the introduction of groundbreaking MagPack™ technology. This innovative packaging technique shrinks the size of power modules by up to 50% compared to previous generations, all while doubling power density and maintaining excellent thermal performance.

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Smaller Size, Bigger Impact

Imagine squeezing twice the power into half the space. That's the magic of MagPack. This technology allows designers in industrial, enterprise, and communication applications to achieve previously impossible performance levels.

Jeff Morroni, director of power management research and development at TI’s Kilby Labs, said: “Designers turn to power modules to save on time, complexity, size and component count, but these benefits have required a compromise on performance – until now.  After nearly a decade in the making, TI’s integrated magnetic packaging technology enables power designers to meet the defining power trend that has shaped our industry – pushing more power in smaller spaces efficiently and cost-effectively.”

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Industry-Leading Performance

Here's what sets these new modules apart:

  • Unmatched Size: Three of the modules, the TPSM82866A, TPSM82866C, and TPSM82816, claim the title of the industry's smallest 6A power modules. This translates to significant space savings on circuit boards.
  • Double the Power Density: MagPack crams more power into a smaller footprint, delivering nearly 1A per 1mm² of area – an industry-leading feat.
  • Reduced EMI: The modules significantly cut down on electromagnetic interference (EMI), minimizing noise and signal disruption.
  • Improved Efficiency: Expect up to a 2% efficiency boost compared to previous models, leading to lower power consumption.
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Benefits Beyond Size

The advantages of MagPack extend far beyond miniaturization. This technology is a boon for data centers, where space is at a premium and energy costs are a major concern. With MagPack, data centers can pack more power into smaller spaces while keeping energy consumption in check, especially considering predictions of a 100% increase in power demand by the end of the decade.

Device

Input voltage range

Description

MagPack package

TPSM82866A

2.4V to 5.5V

Industry’s smallest 6A step-down module with integrated inductor and 13 fixed VOUT options

2.3mm by 3mm

TPSM82866C

2.4V to 5.5V

Industry’s smallest 6A step-down module with integrated inductor and I2C interface

2.3mm by 3mm

TPSM828303

2.25V to 5.5V

3A step-down module with integrated inductor and noise-filtering capacitors

2.5mm by 2.6mm

TPSM82816

2.7V to 6V

Industry’s smallest 6A step-down module with adjustable frequency and synchronization

2.5mm by 3mm

TPSM82813

2.75V to 6V

3A step-down module with adjustable frequency and synchronization

2.5mm by 3mm

TPSM81033

1.8V to 5.5V

5.5V, 5.5A valley current limit boost module with power good, output discharge, and pulse-frequency and pulse-width modulation control

2.5mm by 2.6mm

 

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