Taiwan Ministry of Economic Affairs focusing on silicon photonics platforms and 3D chip modules

The Ministry of Economic Affairs, Taiwan, is focusing on silicon photonics platforms and 3D chip modules to strengthen the innovation industry chain, driving over NT$2.4 billion in investment to accelerate the implementation of AIoT applications.

The 2025 SEMICON Taiwan International Semiconductor Exhibition opened on Sept. 10th. The Industrial Technology Department of the Ministry of Economic Affairs integrated the Industrial Technology Research Institute and the Metal Center to create the "Ministry of Economic Affairs Science and Technology R&D Theme Pavilion".

They worked with companies such as ASE, Chengxiang Technology, Heya Intelligent Technology, Xunchen International, and Deli Technology to showcase 37 forward-looking technologies, fully demonstrating the R&D capabilities and industry chain strength in key areas such as AI chips, advanced manufacturing and packaging and testing equipment, and compound semiconductors.

The highlights of this exhibition include silicon photonic chip technology with the advantages of high-speed transmission and low power consumption. Through high-density heterogeneous integration and low-loss optical design, it can effectively solve the high-speed transmission bottleneck of AI data centers. The world's first new chip module with a highly flexible design, the "3D customized chip universal module", can improve product development efficiency by 70%. The two technologies have jointly promoted more than 2.4 billion yuan in major industrial investment, driving the accelerated implementation of AIoT product applications.

Zhou Chongbin, Deputy Director of the Department of Industrial Technology (DIT) at the Ministry of Economic Affairs, stated that generative AI and high-speed computing are driving a more than 70- fold increase in data center traffic from 2010 to 2024 , driving demand for high-speed transmission and high-performance chips. Over the past five years, the DIT has invested nearly NT$ 40 billion, focusing on AI, high-performance computing ( HPC ), silicon photonics, advanced packaging, and compound semiconductors.

This has promoted chip hardware and software integration and the development of independent advanced manufacturing, aiming to build a more resilient, technologically advanced, and independently controllable advanced semiconductor supply chain in Taiwan. Among them, the Industrial Technology Research Institute (ITRI) has successfully developed Taiwan's first 1.6 Tbps silicon photonics light engine module, achieving international performance standards.

The ITRI has collaborated with ASE and other industry players to create the "Silicon Photonics Semiconductor Open Platform," providing one-stop services for design, manufacturing, integration, and packaging and testing to accelerate data center upgrades. They have also launched the world's first " 3D Customizable Chip Universal Module," enabling chips to be quickly assembled like building blocks, eliminating the need for scratch design. This reduces development time by 70% and reduces costs.

The module has served over 133 companies and facilitated over NT$ 2.1 billion in investment. These achievements not only inject new momentum into the AIoT but also strengthen the autonomy and competitiveness of Taiwan's semiconductor supply chain, ensuring Taiwan's continued key role in the global arena of high-speed computing and intelligent applications.

Zhang Shijie, VP of the Industrial Technology Research Institute (ITRI) and Director of the Electro-Optical Systems Division, stated that ITRI is committed to the research and development of forward-looking semiconductor and AI technologies, and is using system integration thinking to drive industry chain upgrades, demonstrating Taiwan's key capabilities in the next generation of high-speed computing and smart manufacturing. Faced with rapidly rising global data transmission demands, traditional optoelectronic architectures are gradually reaching their limits.

ITRI has pioneered breakthroughs in the development of silicon photonics light engine modules, using advanced packaging to highly integrate optoelectronic components. This not only significantly reduces latency, improves bandwidth and efficiency, but also successfully connects the industry to create an "Open Silicon Photonics Semiconductor Platform," helping Taiwanese companies directly tap into new international opportunities.

Furthermore, ITRI has developed the world's first 3D customized chip universal module, shortening the development process from over six months to 12 weeks. The module is smaller in size, but more fully functional. It has been successfully transferred to Suntech International and has partnered with Xinxing Electronics and Dingchen Technology to build pilot production lines, helping the industry overcome performance and yield bottlenecks and become a key engine for accelerating Taiwan's AIoT industry.

These achievements not only fill the international technology gap, but also demonstrate Taiwan's leading position in the global semiconductor competition. In the future, ITRI will continue to promote the AIization of semiconductors and build a more resilient and competitive industrial ecosystem.

2025 SEMICON TAIWAN "Ministry of Economic Affairs Science and Technology R&D Theme Pavilion"

Silicon photonics technology accelerates high-speed transmission to a new milestone
Traditional methods require data from a computing chip to be transmitted through a circuit board to an optical chip before being output. This results in long transmission paths and limited speeds. ITRI, by combining silicon photonics with advanced packaging technology, achieves highly integrated optoelectronic components, enabling real-time data transmission.

This significantly reduces latency, increases bandwidth, and improves efficiency, laying the foundation for the ultra-high-speed, low-power transmission capabilities required for data centers and high-performance computing. ITRI has successfully developed Taiwan's first 1.6 Tbps silicon photonics optical engine module, achieving performance comparable to Nvidia's GTC 2025 international standards.

Simultaneously, ITRI is collaborating with the industry to create the "Silicon Photonics Semiconductor Open Platform," combining high-density component design (2.5D/3D) with ultra-high-speed and multi-channel measurement capabilities (224Gbps/Lane) and heterogeneous packaging for optoelectronic chips. This one-stop service helps the industry rapidly develop silicon photonics technology.

It also successfully connects supply chain partners across design, manufacturing, packaging, measurement, and equipment, strengthening Taiwan's global competitiveness in next-generation high-speed computing     The world's first 3D customized chip universal module chiplet accelerates the launch of AIoT

Traditional System-in-Package (SiP) development takes six months to a year, and repeated verification often delays product launch. ITRI has pioneered the world's first " 3D Customizable Chip Universal Module." By embedding an active switch chip within a prefabricated interconnect substrate, this technology effectively shortens development time to 12 weeks, increasing efficiency by 70% and potentially breaking through the bottleneck of bringing AIoT products to market.

A standardized substrate has also been developed that complies with JEDEC international standards, ensuring high yield and reducing production complexity. Its flexible design accommodates a wide range of sensors, reducing the module size by 30% while still integrating multiple I/O interfaces, Full-HD image processing, high-speed AI computing, and RF transmission, creating the world's smallest development board.

This technology has been successfully applied and transferred to a micro-module commissioned by SunCenter International and is expected to cover 70% of the AIoT market. Pilot production lines have been established in partnership with companies such as Xinxing Electronics and Dingchen Technology, driving over NT$ 2.1 billion in investment and establishing itself as an accelerator for Taiwan's AIoT industry.

Microscopic interferometry synchronous inspection module to master wafer size and morphology in one stop
Advanced packaging stacking processes are becoming increasingly complex. Traditional inspection requires multiple instruments and is unable to simultaneously determine the relationship between dimensional ( 2D ) and morphological ( 3D ) characteristics. This module combines 2D microscopy and 3D interferometry in a single optical path, eliminating the need for multiple-station handling and realignment. This can shorten inspection time by 50% and reduce equipment costs by 40%.

It also offers high-resolution analysis capabilities over a wide range (400 μm) and at the nanoscale (<0.5 nm). This module has already assisted Chengxiang Technology in developing 5G antenna module inspection equipment and collaborated with Taiwan's Siam King to develop HAMR hard drive inspection equipment to meet the demands of advanced packaging processes.

Array field of view × nano-precision: Efficient inspection solutions for next-gen packaging
Global semiconductor and electronic process advanced packaging production capacity continues to grow. In response to the demand for improved inspection efficiency, Industrial Technology Research Institute (ITRI) has pioneered Taiwan's first miniaturized array lens technology, achieving 2x2 multi-lens automated microscopic calibration.

This technology can be applied to nano-level inspection equipment such as advanced packaging, μ LEDs, and passive components. Compared to traditional single-lens inspection systems, this technology expands the inspection field of view by 4 times, maintains high precision, and improves inspection efficiency by four to 10 times, meeting the process requirements of nano-level in-line inspection. The institute has collaborated with domestic equipment manufacturers and system integrators to develop prototype equipment and has completed verification of National Institute of Standards and Technology (NIST) standard parts, μ Bumps , and μ LED samples.

Wafer surface particle detection equipment accurately monitors transparent wafer quality
Wafer surface particle inspection is a critical process in semiconductor manufacturing. Existing optical inspection technologies are slow and lack sensitivity, making them inadequate for transparent wafers and smaller particle sizes. ITRI has independently developed an oblique-incidence laser scattering optical module and algorithm capable of inspecting materials such as silicon, silicon carbide, and glass, down to a particle size of 0.2 μm. Inspection is completed in just four minutes on an 8-inch wafer.

Currently, ITRI is helping domestic wafer fabs implement this inspection application, with Shengge Technology and Heya Smart Technology applying it to inline inspection of glass substrates and Jiya Semiconductor SiC wafers. This helps the industry improve yield and reduce costs, fills the gap in international transparent wafer inspection standards, and supports the development of domestically produced equipment to strengthen the resilience of the domestic supply chain.

Exhibition arrives
The 2025 SEMICON Taiwan International Semiconductor Exhibition has arrived. The Ministry of Economic Affairs' Department of Industrial Technology and Innovation (DIIT) has integrated the Industrial Technology Research Institute (ITRI) and the National Center for Metals to create the "MOEA Technology R&D Pavilion."

The pavilion, showcasing 37 cutting-edge technologies, will showcase the R&D capabilities and industry chain strength in key areas such as AI chips, advanced manufacturing and packaging equipment, and compound semiconductors.

In the picture above, from left to right: Lan Yuping, CEO of the ITRI Measurement Center; Zhang Zhenyuan, Director of the ITRI Mechanical Laboratory; Zhang Shijie, VP and Director of the ITRI Electro-Optics Laboratory; Lin Zhimin, Chairman of Xunchen International; Lin Jianghuai, VP of Deli Technology; Zhou Chongbin, Deputy Director of the DID; Hong Zhibin, VP of ASE; Shi Wenji, Chairman of Heya Smart Technology; Xie Jiaxiong, GM of Chengxiang Technology; Lin Liequan, Vice CEO of the National Center for Metals; Zhu Junxun, CEO of the ITRI Sensing Center; and Lin Xinhan, Special Assistant to the Chairman of Corlink Technology.

ITRI ​​has successfully developed Taiwan's first 1.6 Tbps silicon photonics light engine module, achieving international performance standards. The company is also collaborating with the industry to create the "Silicon Photonics Semiconductor Open Platform," providing one-stop services to help companies rapidly develop silicon photonics technology. Pictured, from left, are ASE VP, Hong Zhibin; Deputy Director of the Department of Industrial Technology, Ministry of Economic Affairs, Zhou Chongbin; ITRI VP and Director of the Electro-Optical Research Institute, Zhang Shijie; and ITRI Electro-Optical Research Institute Group Leader, Wu Mingxian.