Specialized AI chips will play an increasingly critical role: Tessolve

Tessolve started in 2004 as a failure analysis lab. It later moved to assembly, testing, and marking/packaging (ATMP), an integral part of the semiconductor manufacturing value chain. 

According to them, expertise in areas like AI and ML, chiplet-based architectures, and advanced packaging technologies will become increasingly important as the semiconductor industry evolves.

Srini Chinamilli, Co-Founder & CEO, Tessolve, tells us more. Excerpts from an interview: 

DQ: As a leader in semiconductor and AI chip design, what key trends do you think will shape the future of AI in your industry?

Srini Chinamilli: The year 2024 was transformative for semiconductor companies focusing on AI chips, with exponential growth across the board. This momentum is likely to continue, driven by advancements in specialized AI chips and edge AI technologies. 

In the future, we will see more AI chips tailored for specific applications like natural language processing (NLP), computer vision, and edge AI. This includes technologies like ASICs and FPGAs, designed to deliver high performance, efficiency, and cost-effectiveness for niche applications. This presents increased demand for custom silicon and will result in more job creation in this space.

AI will also change the way we do silicon productization and will significantly shorten the development cycles in the near future. AI will be increasingly applied in time consuming and repetetive tasks in chip design and data analysis in manufacturing. Tessolve is at the forefront of these new technologies and trends. 

Our recent acquisition, DCT helps companies design state-of-the-art ASICs. We are also collaborating extensively with the world’s leading semiconductor companies to develop advanced edge AI solutions, further cementing our leadership in this evolving landscape. 

DQ: With AI being used in more and more ways, how do you think the role of specialized AI chips will change in the next five years?

Srini Chinamilli: Specialized AI chips will play an increasingly critical role over the next five years as AI applications continue to expand. These chips will drive advancements in industries like healthcare, automotive, and IoT by providing tailored solutions for specific tasks such as NLP, computer vision, and edge AI. 

Energy efficiency will remain a top priority, with specialized designs optimizing power consumption without compromising performance. Customizable architectures like FPGAs and chiplets will accelerate development and deployment, making these chips integral to scalable and sustainable AI growth.

Chiplets, in particular, are gaining traction in data centers, hyperscalers, and high-performance computing. At Tessolve, we recognized the potential of chiplets early on and began investing in this technology through our CoE initiatives. Today, we are a preferred partner for leading-edge companies, collaborating on cutting-edge chiplet solutions.

DQ: There is often a shortage of talent in the semiconductor field, especially for AI and specialized chip design. What steps is Tessolve taking to attract and keep top talent?

Srini Chinamilli: As a key aspect of our mission, talent has been central to our growth, and we have made significant investments in talent. In line with this, we launched the Advanced Semiconductor Product & Test Engineering course, in collaboration with industry experts and senior technology leaders at Tessolve. 

Initially developed as an internal program, its success highlighted the growing demand for a skilled workforce and the significant skill gap in the semiconductor industry. This prompted us to extend this program to external candidates and equip young engineers with the practical skills necessary to excel in this rapidly evolving field. 

We have best of class training program to train these engineers. Also, we invest a lot in our CoE initiatives where engineers are trained to work on cutting edge technologies and develop industry ready solutions.

DQ: For young professionals wanting to join the semiconductor industry, what key skills do you think are most important now, and in the future?

Srini Chinamilli: For young professionals aspiring to join the semiconductor industry, both technical and soft skills are crucial to thrive in this dynamic field. Currently, a strong foundation in electronics and semiconductor fundamentals is essential, including knowledge of IC design, VLSI, and fabrication processes. Proficiency in hardware description languages like Verilog , as well as simulation tools, such as SPICE, is highly valued. 

Looking to the future, expertise in areas like AI and machine learning, chiplet-based architectures, and advanced packaging technologies will become increasingly important as the industry evolves. Skills in software-hardware co-design, low-power design, and system-level verification will also be in high demand.

On the soft skills front, problem-solving, collaboration, and an eagerness to learn are vital, given the industry's fast-paced and innovation-driven nature. Staying updated with emerging trends and being adaptable to new technologies will ensure long-term success in the semiconductor domain.

DQ: What career paths do you think are the most exciting in the semiconductor and AI chip field for new engineers and developers? 

Srini Chinamilli: The semiconductor and AI chip fields offer diverse, high-growth career opportunities for new engineers. Some exciting roles include IP core developers, EDA tool developers, ASIC design engineers, analog/mixed-signal design engineers in R&D and test/product engineers. 

With AI's growing influence in automotive, consumer electronics, and IoT, there are immense opportunities for engineers specializing in AI-specific chip architectures and edge AI processing. 

At Tessolve, we are always on the lookout for talented individuals passionate about the semiconductor industry. If you're eager to explore opportunities and realize your potential in this dynamic field, we’d be thrilled to have you join us at Tessolve.