Silex announces Wi-Fi 6E tri-band embedded module based on NXP IW623 chipset

Silex Technology America, a global provider of secure and reliable wireless solutions, announced the launch of the SX-SDMAX6E, the embedded module based on NXP Semiconductors ' IW623 tri-band Wi-Fi 6E chipset.

Packed with next-generation capabilities, the SX-SDMAX6E is purpose-built for performance-critical, battery-powered devices in medical, industrial, and factory automation settings, making it ideal for battery-powered or compact embedded devices.

Unleashing the power of Wi-Fi 6E
Wi-Fi 6E opens up the uncluttered 6 GHz spectrum, enabling ultra-fast, low-latency, and interference-free connections. Combined with SDIO host interface support and optimized for low power, the SX-SDMAX6E delivers blazing speeds and rock-solid stability – all without draining your battery.

"This is really a huge moment for wireless innovation," said Matthew Buckett, President, Silex Technology America. "Getting to the market with a module based on NXP's IW623 chipset is no accident – it's the result of deep collaboration, relentless testing, and our commitment to delivering an Absolutely Must Connect experience to the industries that depend on us most."

"The collaboration with Silex brings the IW623 to life in a highly optimized module for industrial and medical applications," said Larry Olivas, VP and GM, Wireless Connectivity, NXP Semiconductors. "Silex's Gold Partner status is a reflection of their deep wireless expertise and dedication to quality that our customers expect ."

Mass production is set for April 2026, but Silex is already opening doors for early adopters.