SEMICON Korea opens to strengthen innovation and connectivity across global semiconductor ecosystem

By strengthening collaboration and sharing a unified vision at SEMICON Korea, we can accelerate the innovation, and ensure the industry is ready to meet the opportunities ahead

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DQI Bureau
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Fueled by the rapid advancement of AI and the widespread adoption of advanced applications, the semiconductor industry has moved beyond a traditional upcycle and entered a new phase of powerful momentum.

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Amid this shift, Korea’s semiconductor ecosystem—led by Samsung Electronics and SK hynix and supported by a broad range of materials, parts, and equipment companies—is reaching a critical inflection point. At this pivotal moment, SEMICON Korea 2026 will bring together the global semiconductor ecosystem to explore new business opportunities and present the future direction of technological innovation.

The event will be held this week in Seoul from February 11-13. Registration is open.

Approximately 550 companies will showcase advanced semiconductor manufacturing technologies and solutions across more than 2,400 booths at SEMICON Korea 2026.

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Global chipmakers and design leaders—including NVIDIA, Samsung Electronics, SK hynix, Intel, Kioxia, Micron, and Sony—will join major equipment and materials companies such as ASML, Applied Materials, Lam Research, Tokyo Electron, and KLA, bringing together leaders from across the entire semiconductor value chain.

“As AI transforms every facet of semiconductor design and manufacturing, alignment across the global supply chain has never been more critical,” said SEMI Korea President Hyun Cha. “Korea’s vibrant semiconductor ecosystem holds a crucial position in shaping this new era. By strengthening collaboration and sharing a unified vision here at SEMICON Korea, we can accelerate innovation and ensure the industry is ready to meet the opportunities ahead.”

Under the theme “Transform Tomorrow,” this year’s event will present a platform for cutting-edge technologies and collaboration that will reshape the future amid a new industrial paradigm driven by AI.

Over three days, more than 200 semiconductor experts will speak across over 30 conferences, covering key industry topics including advanced manufacturing technology, AI, smart manufacturing, metrology and inspection, test, compound power semiconductors, cybersecurity, market trends, investment opportunities, and global R&D collaboration.

This year’s event will take place at the largest scale in its history, spanning all halls (A, B, C, D, and E) of COEX, as well as the Grand Ballroom, Platz, The Westin Seoul Parnas, and the Grand InterContinental Seoul Parnas. As the rapid growth of Korea’s semiconductor industry has driven demand beyond the exhibition venue’s capacity, the event’s expansion into nearby hotels reflects the remarkable expansion of the industry itself.

SEMICON Korea 2026 will open with a keynote session featuring Samsung Electronics, ASE, Cadence, Lam Research, SK hynix, and NVIDIA.

SEMICON Korea 2026 keynotes
* Beyond ZFLOPS: What's Next? - Architecting the Future of AI Systems -- Jaihyuk Song, Corporate President and CTO, Samsung Electronics.
* Advanced Packaging and the Future of System Optimization -- Tien Wu, CEO, ASE
* Building Scalable Infrastructure for the AI Factories of Tomorrow: Cadence’s End-to-end Approach -- Boyd Phelps, Senior Vice President and General Manager, Silicon Solutions Group, Cadence Design Systems
* The Velocity Imperative -- Tim Archer, President and CEO, Lam Research
* The Inflection Point Has Arrived: Driving Innovation Towards Future of Memory Technology -- Sunghoon Lee, Senior VP and Head of R&D Process, SK hynix
* AI Supercomputing for Next-Generation Semiconductor Design and Manufacturing -- Timothy Costa, GM, Industrial and Computational Engineering, NVIDIA.

Key highlights of SEMICON Korea 2026

Technology conferences
SEMI Technology Symposium (STS): Industry experts will share advanced technology trends in six sessions on semiconductor manufacturing:
* Advanced Lithography
* Advanced Materials & Process Technology
* Device Technology
* Plasma Science & Etching Technology
* CMP & Cleaning Technology
* Advanced Packaging.

AI Summit: Co-hosted by SEMI and KAIST, the AI Summit will bring together KAIST faculty along with representatives from Samsung Electronics, SK hynix, and global equipment leaders to present technology strategies and future roadmaps driving AI-powered industrial innovation, while sharing key solutions that will accelerate the AI era.

Test Forum: Industry experts will explore how next-generation AI-driven test strategies, advanced automated test equipment (ATE), and sophisticated data analytics are supporting the development of next-generation semiconductor devices.

Compound Power Semiconductor Summit: This summit will examine the entire compound power semiconductor value chain—from manufacturing (single crystal, epi-wafer, ion implantation) to high-performance power system integration (devices and modules)—while presenting the technology and market outlook for wide bandgap (WBG) semiconductors.

Cyber Security Forum: Global experts will address critical cyber security challenges across the semiconductor ecosystem, including compliance, fab security, and AI data governance, while sharing collaborative strategies to strengthen digital trust.

MI (Metrology & Inspection) Forum: As advanced semiconductor manufacturing grows increasingly complex, experts from device and equipment companies will present the latest trends and solutions in metrology and inspection technologies.

Smart Manufacturing Forum: This forum will highlight how AI, digital twins, and real-time data technologies are transforming semiconductor manufacturing, sharing the latest trends and success cases for the era of autonomous manufacturing.

Global Semiconductor Regulatory Outlook Forum: The forum will examine international and domestic regulatory trends, evolving energy policies, and customer-centric compliance strategies shaping the semiconductor industry.

Business Forums
Market Trends Forum: In collaboration with global research organizations, SEMI will provide a comprehensive analysis of macroeconomic conditions, regulatory changes, and key trends across the semiconductor market, packaging, equipment, and materials sectors—supporting strategic decision-making in a rapidly evolving industry.

U.S. Investment Forum: Co-hosted by SEMI Korea and SelectUSA, this session will introduce the U.S. investment environment and market outlook to Korean companies while providing opportunities for direct engagement with major semiconductor clusters and regional Economic Development Organizations (EDOs).

Startup Summit: Semiconductor and display startups will showcase innovative technologies and explore growth opportunities through networking with industry leaders and investors.

Netherlands-Korea Semiconductor Tech Seminar: Companies and research institutes from the Netherlands and Korea will gather to strengthen semiconductor R&D collaboration through technology exchange, joint research, and strategic partnerships.

Supplier Search Program: This program offers targeted networking opportunities to support domestic semiconductor materials, components, and equipment companies expanding into global markets. Industry leaders such as Intel, Kioxia, Lam Research, Micron, and Sony will participate in approximately 100 business meetings with Korean companies.

Workforce Development Initiatives
To address the growing need for talent in the semiconductor industry, SEMICON Korea 2026 will once again host dedicated workforce development programs.

Meet the Experts!: A mentoring program designed to nurture future semiconductor talent will connect STEM university students with engineers from leading semiconductor companies, who will provide practical guidance on career development, job roles, and industry insights.

Technology Tutorials: Foundational training sessions will be offered for STEM students and junior engineers, covering the fundamentals of six key semiconductor manufacturing processes: lithography, deposition, device, plasma and etching, CMP and cleaning, and packaging.

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