RF front-end modules for mobile: How Chinese OEMs are driving innovation and disruption?

The RF front-end market is undergoing a massive transformation, announces Yole Group in its new report, RF Front-End Module for Mobile 2025. The RF front-end module market for mobile devices is at a critical juncture. 

Valued at $15.4 billion in 2024, the market is characterized by a delicate balance of growth drivers, including continued 5G expansion, and new 5G bands, and headwinds, such as architectural simplification, intense cost pressure, and declining ASPs. The market research & strategy consulting company, Yole Group, forecasts that despite a flat trend through 2027, the market will reach over $17 billion by 2030.

Hassan Saleh, PhD, Senior Technology & Market Analyst, Radio Frequency at Yole Group, said: “The RF front-end module market is entering a new era of competition. Many Chinese OEMs and suppliers are no longer followers. At Yole Group, we see that they are now setting the pace, driving innovation with an expanding domestic ecosystem of foundries and IDMs and technological capabilities. 

"This rising pressure is forcing historical leaders to adapt quickly, streamline their architectures, and protect their market share in an increasingly cost-sensitive environment.”

Chinese players on the rise
Chinese OEMs are the engine of this transformation. In 2024, the Chinese smartphone market grew by 6% year-on-year, fueled by surging demand and AI-driven innovation. Huawei’s comeback has been spectacular, posting 25% YoY growth and reclaiming the premium segment, while Vivo captured the number one spot with a 17% share. Xiaomi, Oppo, and Honor maintained solid positions with 15% each, creating a highly competitive domestic landscape.

These market dynamics have empowered Chinese RF suppliers to propose innovative solutions and develop a vertically integrated supply chain, particularly at the filter level and including SAW and BAW. This ecosystem is supported by government incentives, and positions Chinese players to challenge long-established suppliers.

Ihor Pershukov, Technology & Cost Analyst, Radio Frequency at Yole Group, added: "Filters are the second-largest RF front-end market segment, and despite the rise of SiP modules, some applications still require discrete filters, creating a strong opportunity to assess BAW technologies across players, applications, and costs."

Global competitive pressures
Traditional leaders such as Qualcomm, Broadcom, Qorvo, Skyworks, and Murata still control over 70% of the global market but are facing increasing competition. Qualcomm leads with a 21% share, thanks to its end-to-end platform strategy, followed by Broadcom with 18%, due to its FBAR filter solutions for Apple. However, pricing pressure and Chinese OEM preferences are reshaping design wins and margins.

For example, the Chinese player, Maxscend, leads among Chinese suppliers with a 4% share, dominating in discrete devices and growing its module business through vertical filter integration. Other Chinese companies such as Lansus, Vanchip, OnMicro, SmarterMicro, and HiSilicon are also gaining traction, benefiting from Huawei’s domestic supply chain realignment and its push to secure local design wins.

Looking ahead to 6G: Are you ready?
The next battlefield will be 6G, starting with 6 GHz band front-end modules and progressing to FR3 modules by the end of the decade. Unlike during the 5G rollout, Chinese companies are expected to enter 6G with full domestic capabilities, supported by strong government backing and an evolving foundry ecosystem — a shift that could redefine the global RFFE market balance. 

Key takeaways
* The market to reach more than $17 billion by 2030: Despite flat growth through 2027, the RF front-end market will expand, driven by 5G, new frequency bands, and early 6G rollout.
* Chinese players are disrupting the market: Huawei, Vivo, Xiaomi, Oppo, and Honor lead a fiercely competitive Chinese smartphone market, enabling domestic RF suppliers to scale and innovate.
* Shift toward simplification and compactness: Chinese OEMs are shifting toward co-integration of multiple functionalities into a smaller number of modules, reducing the BoM and PCB space.
* Global leaders under pressure: Qualcomm (21% share), Broadcom (18%), Qorvo, Skyworks, and Murata face cost pressure and shrinking share as Chinese competitors gain traction.
* 6G on the horizon: R&D is accelerating on 6 GHz and FR3-band modules, with Chinese players preparing to enter the 6G era with significant in-house capabilities.