Rebellions and CoAsia SEMI to co-develop next-gen AI chiplets based on Rebel

Rebellions and CoAsia SEMI began their collaboration in April when they secured a national R&D project for developing multi-petaflops-class Process-in-Memory (PIM) server semiconductor chiplets

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Rebellions has partnered with system semiconductor design company CoAsia SEMI to jointly develop AI chiplets and software solutions for data centers.

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The two companies held a signing ceremony for a development and supply agreement for AI chiplets based on Rebellions’ next-generation AI semiconductor, Rebel. The ceremony was attended by the CEOs of both companies, as well as Hee-Jun Lee, Chairman of the CoAsia Group.

Rebellions and CoAsia SEMI began their collaboration in April when they jointly secured a national R&D project for developing multi-petaflops-class Process-in-Memory (PIM) server semiconductor chiplets.

This joint development targets commercialization of products for data centers. It integrates CoAsia SEMI’s 2.5D silicon interposer and advanced packaging analysis, development, and manufacturing technologies.

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Compared to traditional single SoC (System on Chip) architectures, the chiplet technology offers superior design flexibility, yield, power efficiency, and performance optimization—making it a key technology for AI servers in data centers and high-performance computing (HPC) environments.

The two companies stated, “We aim to complete product development and validation by the end of 2026 and begin large-scale mass production for domestic and global AI data centers.”

Rebellions also plans to commercialize its enhanced-performance AI semiconductor, ATOM MAX, within this year. In the second half of the year, the company will unveil a new product called Rebel Quad, which features a chiplet architecture and next-generation high-bandwidth memory (HBM3E).

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Sung-Hyun Park, CEO of Rebellions, stated: “This collaboration is part of Rebellions’ AI semiconductor product diversification strategy. Together with CoAsia SEMI, we will build an advanced packaging ecosystem.”

DS Shin (Dong-Soo Shin), CEO of CoAsia SEMI and Head of the Semiconductor Division at CoAsia Group, added: “The technical cooperation between our companies will play a pivotal role in the AI semiconductor ecosystem. We are committed to maintaining a technological edge in the rapidly growing AI semiconductor market.”

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