Rapidus in collaboration with Siemens for 2nm semiconductor design

Rapidus Corp. has announced a strategic collaboration with Siemens Digital Industries Software for semiconductor design and manufacturing processes for the 2nm generation. 

Rapidus will collaborate with Siemens to jointly develop a process design kit based on the Calibre platform, the industry-standard verification solution that enables highly accurate and efficient physical verification, manufacturing optimization and reliability assessment, from semiconductor design through to fabrication, while continuing to further its design and verification ecosystem.

This collaboration supports the manufacturing for design (MFD) concept advocated by Rapidus to achieve high yield and short turnaround time from the early stages of manufacturing. 

Further, Rapidus and Siemens EDA will build a reference flow that holistically supports design, verification and manufacturing from front-end to back-end. This reference flow provides a smooth development environment for Rapidus’ Rapid and Unified Manufacturing Service (RUMS).

Mike Ellow, CEO of Siemens EDA, Siemens Digital Industries Software, said: “Our work with Rapidus signifies the deep integration of Siemens’ EDA technology into a new manufacturing base. Through the creation of a reference flow utilizing products such as Calibre and Solido, we will jointly build a future of semiconductor manufacturing that excels in reliability, speed, scalability and safety.”

Rapidus is creating a new approach that integrates the entire foundry process from design to manufacturing. With the secure management of design data, ensuring manufacturing traceability and reducing information leakage risks through collaboration with EDA providers, Rapidus will strengthen its supply chain reliability.

Dr. Atsuyoshi Koike, CEO of Rapidus, stated: “Rapidus is dedicated to advancing the co-optimization of manufacturing and design and is committed to providing a design environment that dramatically speeds up the realization of customer needs for next-generation semiconductors. 

"Our collaboration with Siemens will embody this mutual optimization, for our Design Manufacturing Co-Optimization (DMCO) concept. Rapidus, as a state-of the-art semiconductor foundry, will dramatically shorten the time to tape-out by achieving MFD for the 2nm gate-all-around process.”