Odisha signs two MoUs @ Semicon India 2025; aims to become semicon hub

The Odisha government has secured investment intents worth Rs 2,655 crore at the ongoing Semicon India 2025 conference in New Delhi, marking a major push towards its ambition of becoming a hub for semiconductors and advanced electronics.

On the inaugural day of the three-day event on Tuesday, the state signed two memorandums of understanding (MoUs). The first of these was with TopTrack Hi-Tech PCB Pvt Ltd for a Rs 1,005 crore advanced printed circuit board manufacturing facility.

The second MoU was signed with Sancode Technologies Ltd, which committed Rs 1,650 crore for a semiconductor-related facility backed by its global partners, according to reports from ANI.

During the event, Odisha CM Mohan Majhi highlighted the state’s Semiconductor Manufacturing & Fabless Policy 2025, and Electronics Component Manufacturing (ECM) Policy 2025 as key drivers for building a strong innovation and manufacturing ecosystem.

He also inaugurated the Odisha pavilion at the conference, where the state showcased its roadmap for electronics and emerging technologies.

Strategic engagement with global industry
On Wednesday, Sep. 3, a high-level delegation led by Electronics and Information Technology Minister Mukesh Mahaling held business discussions with leading companies, including Thomson Computing, Ineuu, ASP Semicon, VVDN Technologies, Brandworks, InSemi (an Infosys company), Felcon Ltd, and Intel.

The dialogues focused on proposals spanning electric vehicles, solar manufacturing, flat panel displays, data centres, PCBs, smart meters, fintech hardware, AI skilling, and affordable learning devices.

International partnerships
The state also hosted four dedicated roundtable sessions with partner nations Singapore, Malaysia, the United States, and the Netherlands, exploring avenues for bilateral cooperation, supply chain resilience, and industry-to-industry collaboration in the semiconductor domain.

-- Mohammed Imteshal Karim, Odishatv.in