NVIDIA seeks to raise HBM4 specs in response to AMD competition

TrendForce reports that NVIDIA has recently pressed key component suppliers of its Vera Rubin server racks to upgrade product specifications, specifically requesting that HBM4 speed per pin be raised to 10 Gbps, as AMD gets set to launch its MI450 Helios platform in 2026. Although whether these upgrades can be achieved remains uncertain, SK hynix is expected to maintain its leading position as the largest supplier in the early mass-production phase of HBM4.

HBM4 is being refined to deliver higher transmission speeds and bandwidth as a critical component for AI servers. The base die plays a decisive role in HBM performance. Among the three leading suppliers, Samsung took an aggressive step in 2024 by upgrading the HBM4 base die process node to FinFET 4nm, targeting volume production by the end of the year. Transmission speeds are projected to reach 10 Gbps, and its production share of products enabling 10Gbps is expected to surpass those of SK hynix and Micron.

TrendForce notes that beyond attempting to raise HBM4 specs, NVIDIA’s primary focus remains on supply availability. If volumes are insufficient—or if new specifications drive up power consumption or costs excessively—NVIDIA may abandon the upgrade or segment its platform products by assigning different component tiers to different suppliers. In addition, NVIDIA may extend second-phase certifications after the initial supplier approval stage, giving other vendors more time to adjust. This strategy will directly impact the production ramp-up speed of the Vera Rubin platform.

Looking at the projected 2026 supplier share of HBM4 for NVIDIA, TrendForce believes that based on established partnerships in 2024–2025, combined with technology maturity, reliability, and capacity scale, SK hynix will remain the dominant supplier next year, while Samsung and Micron shares will depend on the progress and performance of their product qualifications.

Source: TrendForce, Taiwan.