Landmark announcements at IESA Vision Summit 2026 propel India’s semiconductor ambition

India Electronics and Semiconductor Association (IESA) successfully concluded the IESA Vision Summit 2026, marking a pivotal moment in India’s ascent as a global semiconductor powerhouse. Over two impactful days, the Summit convened more than 1,500 industry leaders, innovators, policymakers, academia, and technology pioneers to define the next phase of India’s electronics and semiconductor growth trajectory.

The Summit featured a series of high-impact MoUs, strategic partnerships, product unveilings, and talent development initiatives — reinforcing India’s shift toward an integrated, execution-ready semiconductor ecosystem.

Announcements spanned the full value chain, including design, advanced packaging, testing, automation, AI-enabled engineering, workforce development, and commercialization.

During the official unveiling of collaborations and MoU exchanges, Ashok Chandak, President, IESA, said: “India’s semiconductor momentum is now structured, collaborative, and execution-driven — advancing with scale, speed, and global ambition. This was not incremental progress; it was ecosystem alignment in action.

"From backend capability expansion and post-silicon integration to AI-enabled engineering, talent creation, and startup acceleration, these announcements collectively move India from NPI to product ownership and toward scalable volume manufacturing.”

Key announcements that signal momentum
Akeana and Aritrak strategic technology transfer agreement to accelerate sovereign silicon development in India
This will provide high-performance RISC-V IP to India’s fabless ecosystem under a new Tech Collaboration Center (TCC) model, empowering Aritrak as an autonomous local P&L hub. With locally owned and co-developed IP, it advances technological self-reliance and lowers entry barriers for Indian chip designers.

Kaynes Semicon × Terminus Circuits
A strategic partnership integrating post-silicon IP expertise with ATMP and manufacturing capabilities — strengthening India’s design-to-manufacturing bridge and reinforcing domestic value capture.

RRP Electronics × HCL Technologies
A comprehensive backend collaboration combining advanced packaging formats (QFN/DFN, BGA/LGA) with HCL’s world-class test engineering and reliability qualification — enhancing India’s backend semiconductor readiness.

Suchi Semicon × HCL Technologies
An end-to-end semiconductor solution delivered within India — deepening domestic value addition across packaging, testing, and qualification ecosystems.

Advanced certification in IC manufacturing and packaging – launched
A landmark collaboration between IIT Roorkee’s iHub Divyasampark, Siemens EDA, and Maven Silicon — building structured, industry-aligned talent pipelines for fab and OSAT ecosystems.

Emerson NI launches Nigel AI-powered code completion
A significant step toward AI-assisted engineering workflows — accelerating development cycles, improving validation efficiency, and strengthening next-generation electronics systems design.

NXP India tech startup challenge – Season 5
The return of this flagship platform reaffirms India’s commitment to nurturing deep-tech startups and strengthening the semiconductor innovation pipeline.

“IESA Vision Summit 2026 was designed to articulate vision and also to catalyse implementation. The depth of strategic alliances, technology launches, academia-industry programs, and startup empowerment initiatives announced here reflects a maturing, coordinated ecosystem ready to compete and lead globally. We congratulate our member companies on these collaborations and are proud to have provided a platform for these transformative milestones,” Chandak added.