India approves four new semiconductor manufacturing projects

Projects include India’s first commercial Silicon Carbide semiconductor fab, a glass-based OSAT facility, and advanced packaging units catering to sectors like EVs, renewable energy, defence, and high-performance computing.

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DQI Bureau
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India has approved four new semiconductor manufacturing projects worth ₹4,600 crore in Odisha, Punjab, and Andhra Pradesh under the India Semiconductor Mission, aimed at boosting indigenous manufacturing, creating jobs, and reducing import dependence. 

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With these approvals, the total sanctioned projects under ISM now reach 10, with cumulative investments of ₹1.60 lakh crore across six states. 

The projects include India’s first commercial Silicon Carbide semiconductor fab, a glass-based OSAT facility, and advanced packaging units catering to sectors like EVs, renewable energy, defence, and high-performance computing.  

On this development DR. Ajai Chowdhry, Founder HCL, and Chairman EPIC Foundation, said: “India's semiconductor sector is poised for a quantum leap with four key major project approvals SiCS, 3DGS, CDIL, and ASIP. It is good to see that we now will have  compound semiconductor fab, which will cater to power sector needs and glass-based OSAT for display needs. 

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"Building on its strong chip design foundation, India is now set to turbocharge indigenous manufacturing cutting down on reliance on foreign imports. The projects will significantly cater to the growing demand for semiconductors in sectors like electric vehicles, renewable energy, and industrial applications. This gives great positioning to the country in semiconductor technology, and a great decision like this is welcome.

"Under the visionary leadership of Honorable Minister Ashwini Vaishnav, India is poised to achieve technological sovereignty, realize the ‘Vikasit Bharat’ vision, and emerge as a key player in the global semiconductor landscape. We eagerly await this transformative journey."

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