GoI approves first batch of seven projects worth over ₹5500 crores under ECMS

Union Electronics and IT Minister, Ashwini Vaishnaw, announced the approval of first trench of 7 projects under the Electronics Components Manufacturing Scheme (ECMS). Nowc, multi-layer printed circuit boards (ML-PCBs), HDI PCBs, camera modules, copper-clad laminates, and polypropylene films will be made in India.

The move marks a major step in India’s journey from making finished products to manufacturing modules, components, materials, and machineries used to manufacture them.

The new electronics manufacturing units will meet 100% of copper-clad laminates, 20% of printed circuit boards, and 15% of camera modules demand domestically. 60% of the production will be exported, said Vaishnaw.

Overwhelming response for ECMS
The scheme has received wonderful response from both domestic and global companies. 249 applications have been recieved. These represents ₹1.15 lakh crore investment, ₹10.34 lakh crore production, and 1.42 lakh jobs to be created. It is the highest-ever investment commitment in India’s electronics sector.

Today marks the approval for seven projects worth ₹5,532 crore. These projects will lead to production of components worth  ₹36,559 crore and creation of over 5,100 direct jobs.

The approved units are spread across Tamil Nadu (5), Andhra Pradesh (1), and Madhya Pradesh (1). This reinforces the balanced regional growth and expanding high-tech manufacturing beyond metros.

Bridging demand-supply gap
Vaihnaw informed, "20% of our domestic demand of PCBs and 15% of camera module sub-assembly will be met through production from these plants."

He also mentioned that the demand of copper-clad laminates will now completely be domestically met. The additional 60% of production through these plants will be exported.

Product details
The approved projects cover key components like high-density interconnect (HDI) PCBs, multi-layer PCBs, camera modules, copper-clad laminates, and polypropylene films.

Camera modules are compact imaging units that capture photos and videos in electronic devices. Its production in India will enable its usage in smartphones, drones, laptops, tablets, medical instruments, robots, and automotive systems.

HDI and ML-PCBs are the core circuit boards that connect and control every electronic device. These are used in smartphones, laptops, automotive and industrial systems.

Strategic breakthroughs in base materials
ECMS also marks India’s strong entry into component materials manufacturing.

For the first time, India will establish a copper-clad laminate (CCL) manufacturing facility. CCL acts as a base component for manufacturing multi-layer PCBs. These PCBs go into every electronic equipment. Right now, these are imported.

Polypropylene films is the key material used in manufacturing capacitors. This component will be made in India for consumer electronics, automotive, ICT, industrial and manufacturing, telecommunications, and computing equipment.

Economic and industrial impact
* These projects will reduce import dependence and and lower product prices in the domestic market.
* These projects will create high-skill jobs in manufacturing and R&D.
* Trusted supply chains will be built for defence, telecom, EVs, and renewable energy.

India is on its journey towards becoming a product nation, capable of designing, manufacturing, and exporting end-to-end electronic equipment. The scheme complements PLI, and the India Semiconductor Mission (ISM).

It completes the seamless value chain, from devices to chips, components to materials, and from manufacturing to innovation.