SAL receives Applied Materials PECVD tool for 200mm dielectrics thin films deposition
AGC participating in "JOINT3" Consortium to develop next-gen semiconductor packaging
Tech giants accelerate investment, AR glasses shipments to reach 32.1 mn units by 2030
Genesys, ServiceNow push Agentic AI into mainstream customer service
Tariffs on semiconductors? Investment shifts and global geopolitical tensions
Resonac launches 27-member JOINT3 Consortium to develop next-gen semiconductor packaging
China’s chip industry surges in 1H25 — 38 A-share listed firms reportedly post growth